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Chemija / Chemistry

ISSN 0235-7216
ISSN 2424-4538 (online)

2007 m. Nr. 1

Electrochemical investigations of Ni–P electroless deposition in solutions containing amino acetic acid
Ona GYLIENĖ, Algirdas VAŠKELIS, Rima TAROZAITĖ, Aldona JAGMINIENĖ

The complexity of the anodic process taking place during electroless nickel plating in a solution containing hypophosphite as a reducing agent and amino acetic acid as a ligand has been verified by the results of electrochemical investigations. In the case of low nickel deposition rate, vNi–P, c.a. 2–4 μm·h–1, an electrochemical reaction played the main role in the autocatalytic process. With an increase in the intensity of the plating process, the difference between vNi–P and the maximal anodic current intensity ia increased due to the difficulties in estimating the ia value (coupled cathodic Ni deposition reaction has a retarding effect on the anodic process) as well as due to the participation of chemical reactions in the catalytic process. Voltammetric measurements carried out at potentials more positive than the mixed potential showed the increase in Ni–P electrode activity with an increase in anodic polarization.
The rate of catalytic hypophosphite oxidation by H2O estimated as the difference between the volumes of H2 evolved in the anodic process and in Ni–P deposition process was independent of the potential applied. These results as well as the results obtained for hypophosphite solutions, when Ni–P deposition does not proceed, indicate the pure chemical nature of the catalytic oxidation of hypophosphite by H2O.
The stability of the solutions had no relation to the values of neither vNi–P nor ia.

Keywords: Ni–P deposition, hypophosphite, anodic oxidation, voltammograms, surface activation

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