 ISSN 0235-7216 ISSN 2424-4538 (online) |
2007 m. Nr. 1 Thermodynamical aspects of copper(II) reduction
process by cobalt(II)–diethylenetriamine complexes
Calculations show that cobalt(II) complexes with diethylenetriamine (dien) are rather strong reducing agents and are capable of reducing copper(II) ions to the metallic state and therefore can be used in electroless plating systems for the deposition of copper coatings. A thermodinamic analysis of equilibria in a system Cu–Cu(II)–Co(II)–Co(III)–diethylenetriamine (dien) was carried out and the conditions of Cu(II) reduction to metal by Co(II) were predicted. Copper(II) reduction is supposed to occur in pH region from ca. 5 to ca. 9.5 (20 °C). The reduction process is predicted to be strongly dependent on the solution pH and ligand (dien) concentration. The most negative difference of a redox potential (DE) between Cu(II)/Cu and Co(III)/Co(II) couples could reach value of –200 mV. The highest metal deposition rate in the absence of considerable metal formation in the solution bulk was obtained in solutions with predominating Co(II) complexes Codien2+ and Codien22+ at the above-mentioned pH values. Keywords: electroless copper plating, cobalt(II)–diethylenetriamine complexes, copper(II) reduction |
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