The morphology of polyamide PA 6 films modified by mixed copper sulfide–copper telluride layers was studied by the atomic force microscopy method. Copper sulfide–copper telluride, Cu_xS–Cu_yTe, layers on the surface of PA 6 film were formed by treating PA film samples in potassium telluropentathionate, K₂TeS₄O₆, 0.025–0.10 mol · dm^–3 solution and then with Cu(II / I) salt solution. The formation of copper sulfide layers proceeded unevenly, in the form of islands, which later grew into agglomerates. The surface of the layers formed was relatively uneven and rather rough. The maximum height of a Cu_xS–Cu_yTe layer slightly decreased (225–160 nm) with prolonging polyamide treatment in K₂TeS₄O₆ solution. A more significant reduction (220–80 nm) of layer height was observed upon increasing the concentration of chalcogenization solution. The same tendency was observed in changes of the surface roughness. The layer height (90–160 nm) and roughness with increasing the temperature changed irregularly.

Keywords: polyamide, potassium telluropentathionate, copper sulfide–copper telluride layer, morphology, AFM