The morphology of polyamide PA 6 films modified by mixed copper sulfide – copper selenide layers was studied by the atomic force microscopy method. Copper sulfide – copper selenide (Cu_xS–Cu_ySe) layers on the surface of PA 6 film were formed by treating PA film samples in potassium selenopentathionate (K₂SeS₄O₆) 0.05–0.20 mol · dm^–3 solution and then with Cu(II/I) salt solution. The formation of copper chalcogenide layers proceeded unevenly, in the form of islands which later grew into agglomerates. The surface of the layers formed was relatively uneven and rather rough. The average height of a Cu_xS–Cu_ySe layer changed irregularly (~107–1100 nm) with increasing the temperature and concentration of PA chalcogenization solution. The layer roughness varied from ~31 to ~112 nm. The layer roughness with increasing the temperature and the concentration of chalcogenization solution changed irregularly and caused changes in the shape distribution function of the surface elements.

Keywords: polyamide, potassium selenopentathionate, copper sulfide – copper selenide layer, morphology, AFM