Chemija / Chemistry
 ISSN 0235-7216 ISSN 2424-4538 (online) |
2012 m. Nr. 1 Comparative study of electroless copper deposition using different cobalt(II)-amine complex compounds as reducing agents
For the first time, tetraethylenepentamine (Tetraen) and triethylenetetramine (Trien) were applied as ligands in electroless copper plating systems using Co(II)- amine complexes as reducing agents. The highest copper deposition rate (in 2 minutes) determined for tetraethylenepentamine (Tetraen) system was about 3.3 μg cm–2, whereas this rate for triethylenetetramine (Trien) system was lower being 2 μg cm–2. The processes of the dissolution of copper substrate taking place in the solutions of the mentioned amines at certain pH values are discussed. The amines under investigation were proposed as stabilizing agents or plating rate adjusters in electroless copper plating solutions containing other amines as ligands, e. g. ethylenediamine, propylenediamine or diethylenetriamine.
Keywords: electroless copper deposition, cobalt(II) complexes, aliphatic amines |
Issues:
2017 - Vol.28 No. 1, No. 2, No. 3, No. 4 2016 - Vol.27 No. 1, No. 2, No. 3, No. 4 2015 - Vol.26 No. 1, No. 2, No. 3, No. 4 2014 - Vol.25 No. 1, No. 2, No. 3, No. 4 2013 - Vol.24 No. 1, No. 2, No. 3, No. 4 2012 - Vol.23 No. 1, No. 2, No. 3, No. 4 2011 - Vol.22 No. 1, No. 2, No. 3, No. 4 2010 - Vol.21 No. 1, No. 2-4 2009 - Vol.20 No. 1, No. 2, No. 3, No. 4 2008 - Vol.19 No. 1, No. 2, No. 3-4 2007 - Vol.18 No. 1, No. 2, No. 3, No. 4 2006 - Vol.17 No. 1, No. 2-3, No. 4 2005 - Vol.16 No. 1, No. 2, No. 3-4 2004 - Vol.15 No. 1, No. 2, No. 3, No. 4 2003 - Vol.14 No. 1, No. 2, No. 3, No. 4 2002 - Vol.13 No. 1, No. 2, No. 3, No. 4 2001 - Vol.12 No. 1, No. 2, No. 3, No. 4 |