Chemija / Chemistry
 ISSN 0235-7216 ISSN 2424-4538 (online) |
2012 m. Nr. 3 Application of environment-friendly ligands for alkaline electroless copper plating systems: A comparative study
of electroless copper deposition using D-, L- and DL-tartrate as Cu(II) ligands
All investigated isomers of tartaric acid, namely L-tartrate, D-tartrate and a racemic mixture of DL-tartrate, forming sufficiently stable complexes with copper(II) ions in alkaline solutions, were found to be suitable ligands for copper(II) chelating in alkaline (pH > 12) electroless copper deposition solutions. Reduction of copper(II)-tartrate complexes by hydrated formaldehyde was investigated and the copper deposits formed were characterized.
The thickness of the compact copper coatings obtained under optimal operating conditions in 1 h can reach ca. 3 μm, depending on the temperature and nature of the ligand applied. The plating solutions were stable and no signs of Cu(II) reduction in the bulk solution were observed during the experiment time. Results were compared to those for systems operating with other copper(II) ligands. Keywords: copper, tartaric acid, isomers, electroless copper deposition, surface roughness |
Issues:
2017 - Vol.28 No. 1, No. 2, No. 3, No. 4 2016 - Vol.27 No. 1, No. 2, No. 3, No. 4 2015 - Vol.26 No. 1, No. 2, No. 3, No. 4 2014 - Vol.25 No. 1, No. 2, No. 3, No. 4 2013 - Vol.24 No. 1, No. 2, No. 3, No. 4 2012 - Vol.23 No. 1, No. 2, No. 3, No. 4 2011 - Vol.22 No. 1, No. 2, No. 3, No. 4 2010 - Vol.21 No. 1, No. 2-4 2009 - Vol.20 No. 1, No. 2, No. 3, No. 4 2008 - Vol.19 No. 1, No. 2, No. 3-4 2007 - Vol.18 No. 1, No. 2, No. 3, No. 4 2006 - Vol.17 No. 1, No. 2-3, No. 4 2005 - Vol.16 No. 1, No. 2, No. 3-4 2004 - Vol.15 No. 1, No. 2, No. 3, No. 4 2003 - Vol.14 No. 1, No. 2, No. 3, No. 4 2002 - Vol.13 No. 1, No. 2, No. 3, No. 4 2001 - Vol.12 No. 1, No. 2, No. 3, No. 4 |