Chemija / Chemistry
 ISSN 0235-7216 ISSN 2424-4538 (online) |
2013 m. Nr. 1 Application of ultrasound for the systems of electroless copper plating: Influence of ultrasonic irradiation on the plating rate and the surface of coatings
Ultrasound produces specific conditions for reactions in electroless copper plating systems. Electroless deposition of copper using the systems with different ligands (EDTA, saccharose, pentaethylenehexamine) and different reducing agents (formaldehyde, Co(III)/Co(II) redox couple) proceeds differently under ultrasonic irradiation. Depending on the plating system, the plating rate varies from modest decrease (or stopping of the process) to five or more times higher rate, compared with conditions without ultrasound. The dependencies of the surface roughness of the copper coatings obtained on various factors (ultrasonic irradiation, pH, ligands etc.) were determined and discussed. Keywords: electroless copper deposition, ultrasound, saccharose, EDTA, Co(II)/Co(III) |
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