Electrochemical quartz crystal microgravimetry (EQCM) was used for the investigation of the kinetics of electroless deposition of Pt layer on the Cu surface using the Ti⁴⁺/Ti³⁺ ion redox system as a reducing agent. It was found that the mass of the electrolessly deposited Pt increases in the course of time up to 360 s. Under optimum conditions the rate of the electroless Pt deposition was found to be ca. 2.8 μg cm^–2 min^–1. It has been determined that with further increase in time the rate of Pt deposition drops-off, as well as the open-circuit (mixed) potential shifts to the side of more positive values. The Pt film deposited on the surface of PVD Cu coated silicon wafer using the Ti⁴⁺/Ti³⁺ redox couple as a reducing agent is continuous and compact.

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